Components specified in the bill of materials (BOM) are sourced and prepared
for assembly.
SMT (Surface Mount Technology) Assembly:
Surface mount components are placed onto the PCB using
automated pick-and-place machines.
Through-Hole Assembly:
If the design includes through-hole components, these are manually inserted
and soldered on the PCB.
Soldering:
Components are soldered to the PCB using reflow ovens (for SMT) or soldering stations (for
through-hole).
Inspection and Testing:
Assembled PCBs undergo visual inspection, functional testing, and possibly
automated optical inspection (AOI) to detect defects.
Reflow and Cure:
If necessary, the PCBs are subjected to a reflow oven to ensure proper solder
connections, and the solder mask is cured
Cleaning:
The assembled PCBs are cleaned to remove flux residues and contaminants
Final Inspection & Quality Control:
A final inspection ensures that all components are correctly placed,
soldered, and aligned.
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